Implementing CPU/GPU and Reminiscence in a Hybrid 3D Strategy
A expertise for the three-dimensional integration of processing items and reminiscence, as reported by researchers from Tokyo Tech, has achieved the best attainable efficiency in the entire world, paving the way in which to quicker and extra environment friendly computing. Named “BBCube 3D,” this modern stacked structure achieves increased knowledge bandwidths than state-of-the-art reminiscence applied sciences, whereas additionally minimizing the vitality wanted for bit entry.
Within the current digital age, engineers and researchers maintain developing with new computer-assisted applied sciences that require increased knowledge bandwidths between the processing items (or PUs, corresponding to GPUs and CPUs) and reminiscence chips. Some examples of recent bandwidth-extensive functions embody synthetic intelligence, molecular simulations, local weather prediction, and genetic evaluation.
Nevertheless, to extend the information bandwidth, one should both add extra wires between the PUs and the reminiscence, or enhance the information price. The primary strategy is troublesome to implement in observe as a result of transmission between the above-mentioned elements often occurs in two dimensions, making the addition of extra wires difficult. Alternatively, rising knowledge price requires rising the vitality wanted to entry a bit every time, referred to as the ‘bit entry vitality’, which can also be difficult.
Happily, a group of researchers at Tokyo Institute of Know-how (Tokyo Tech) in Japan might now have discovered a viable answer to this downside. In a current IEEE 2023 Symposium on VLSI Know-how and Circuits research, Prof. Takayuki Ohba and colleagues have proposed a expertise referred to as “Bumpless Construct Dice 3D” or BBCube 3D. This expertise holds the potential to resolve the above-mentioned points for higher integration between PUs and dynamic random entry reminiscence (DRAM).
Because the title suggests, probably the most notable side of BBCube 3D is the conclusion of connections between PUs and DRAMs in three dimensions, as an alternative of two dimensions (as seen in Determine 1 above). The group was capable of obtain this feat through the use of an modern stacked construction by which the PU dies sit atop a number of layers of DRAM, all interconnected through through-silicon vias (TSVs).
BBCube 3D’s general compact structure, the dearth of typical solder microbumps, and using TSVs instead of longer wires, collectively contribute to low parasitic capacitance and low resistance. This improves {the electrical} efficiency of the gadget on numerous fronts.
Moreover, the researchers applied an modern technique involving four-phase shielded enter/outputs (IOs) to make the BBCube 3D extra immune to noise. They adjusted the timing of adjoining IO traces such that they’re all the time out of section with one another, which means that they by no means change values concurrently (Determine 2). This reduces crosstalk noise and makes the gadget operation extra sturdy.
The group evaluated the velocity of their proposed structure and in contrast it to that of two state-of-the-art reminiscence applied sciences: DDR5 and HBM2E. “The BBCube 3D has the potential to realize a bandwidth of 1.6 terabytes per second, which is 30 occasions increased than DDR5 and 4 occasions increased than HBM2E,” says Prof. Ohba, whereas explaining the outcomes of their experiment.
Furthermore, BBCube 3D additionally represents a significant breakthrough when it comes to the bit entry vitality. “Because of the BBCube’s low thermal resistance and low impedance, the thermal administration and energy provide points typical of 3D integration may be relieved,” explains Prof. Ohba, “In consequence, the proposed expertise may attain a outstanding bandwidth with a bit entry vitality that’s 1/twentieth and 1/fifth of DDR5 and HBM2E, respectively.”
We certainly hope that the BBCube 3D paves the way in which to quicker and extra environment friendly computing, in flip, boosting the progress of quite a few fields.
Authentic Article: BBCube 3D: A Breakthrough in Semiconductor Integration and Information Transmission
Extra from: Tokyo Institute of Know-how
